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Company Details:
Broadcom Corporation

Founded in 1991, Broadcom was inspired by a vision for high-speed cable and digital subscriber line (DSL) networking for the masses. Today, Broadcom solutions enable the delivery of voice, video, data and multimedia to and throughout enterprise, office, home and mobile environments. A Fortune 500 ® Company, Broadcom provides the industry''s broadest portfolio of state-of-the-art system-on-a-chip (SoC) and software solutions used in computing and networking equipment, digital entertainment and broadband access products, and high-performance mobile devices. 

As one of the world's largest fabless semiconductor companies, Broadcom designs and develops its products in labs and design centers around the world, and then works closely with independent chip-making facilities to manufacture its products. Broadcom produces nearly two billion chips annually. 

Broadcom is headquartered in Irvine, Calif. and has offices in most major cities around the world including research and development facilities in North America, Asia and Europe

Broadcom's global customer roster includes the elite of both consumer and enterprise technology brands – from computing powerhouses to major providers of networking equipment and from home entertainment and gaming systems manufacturers to mobile device and wireless providers. 

Broadcom counts among its expansive customer base a diverse group of worldwide industry leaders including Alcatel- Lucent, Amazon, Apple, Cisco, Dell, DirecTV, EchoStar, H-P, Huawei, IBM, LG Electronics, Nintendo, Nokia, Motorola, Pace, Samsung, Thomson and ZTE, among others.

Job Description:
Position : Manager/Systems Design Engineering -PHY Layer
Location : Bengaluru/Bangalore
Job Profile/Description :

1) Managing teams execution involving understanding of product requirements, translating them to production worthy software code through design, development, documentation, reviews and testing of physical layer signal processing, firmware and control modules

2) Responsible for ensuring that the team’s deliverables are timely and with high quality; should ensure deliverables are aligned with company priorities and product milestones

3) Team’s responsibilities will involve integration of software with Baseband and RF chipsets in an embedded environment, participating in interoperability test, field trials and customer support

4) Requires strong cross-team collaboration and interaction with MAC software, chip design (baseband/RF), physical layer algorithms/simulation, hardware reference design and customer interfacing teams

5) Defining and tracking metrics to improve software development process.

Qualification : UG - B.Tech/B.E. - Electrical, Electronics/Telecomunication AND PG - M.Tech
Experience : 12 - 13 Years
Other/Special Requirements : Product development experience in WiFi/WiMAX/LTE/3G/HSDPA/HSUPA on client/mobile side in a semiconductor company is preferred
   
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