Huawei Technologies announced the development of its Huawei EM772 module integrating Wi-FI and HSPA network standards for Classmate PCs powered by Intel Atom Processors.
Huawei claims that the new module will help manufacturers to reduce size of mobile computing devices as well as the cost of producing them.
“We are confident that the new-generation EM772 will enhance the consumer experience. Innovation continues to be the basic tenet of Huawei’s growth strategy, and will allow us to tap the opportunities presented by the fast-growing laptop market.” said James Chen, Director of Marketing Department, Huawei Terminals.
Hawk Min, Hardware Engineering Team Director of Intel Emerging Market Platforms Group added, “We expect future Classmate PCs with Huawei’s dual-mode wireless solution will enable students in China to enjoy greater wireless connectivity. The module’s small packaging size will also fit well into the thin and light netbook and notebook designs, which are a mobile trend in 2009.”
The module will offer speeds of 5.78 mbps and downlink of 7.2 mbps in the HSPA environment while in the Wi-Fi environment it will offer speeds of 54 mbps.