Texas Instruments Incorporated (TI), leading the industry with the most complete wireless connectivity portfolio for embedded applications, today announced that its Bluetooth v4.0 technology-based CC2560 and CC2564 wireless devices are now available in easy-to-integrate QFN packages offered by TI and its distribution partners.

 TI also announced the availability of additional production-ready modules based on the two devices, as well as software and tools. The QFN packages and various modules give customers choice regarding power, size and cost requirements.

The ROHS-compliant QFN packages of the CC2560 and CC2564 Bluetooth v4.0 devices are available today through TI and its distributors. To further help design efforts, TI encourages customers to download from its wiki a two-layer reference design (schematics, layout and bill of materials) that can be copied and pasted into end applications.

TI will release full-featured evaluation boards and design materials for hardware and software prototyping with the CC2560 and CC2564 QFN devices later this quarter.

TI will also release an updated Bluetooth stack in mid-4Q 2012. The new stack will offer flexible software build options that will enable customers to select specific profiles to support. This capability allows for greater memory size optimization and the ability to support a broader range of MCUs.