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Samsung inks deal with Intel to supply wireless modules for mobiles
TT Bureau |  |  04 Jun 2008

Samsung Electro-Mechanics Co, has inked a deal with Intel Corp. under which the South Korean firm will provide wireless modules which are to be used in different mobile devices to the Giant chipmaker.

 

As a part of the deal, the wireless modules provided to Intel will include WiMAX and WiBro modules which will be used in chipmaker’s soon-to be released ultra-mobile PC and other mobile internet devices.

 

Financial terms of the deal are not disclosed yet.

    
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04 Jun 2008(IST)  
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